US 11,721,566 B2
Sensor assembly and methods of vapor monitoring in process chambers
Xiaozhou Che, Sunnyvale, CA (US); Graeme Jamieson Scott, Sunnyvale, CA (US); Richard Gustav Hagborg, Felton, CA (US); Alan H. Ouye, San Mateo, CA (US); and Nelson A. Yee, Redwood City, CA (US)
Assigned to Applied Materials, Inc., Santa Clara, CA (US)
Filed by Applied Materials, Inc., Santa Clara, CA (US)
Filed on Jul. 13, 2021, as Appl. No. 17/374,189.
Prior Publication US 2023/0018891 A1, Jan. 19, 2023
Int. Cl. H01L 21/67 (2006.01); C23C 14/54 (2006.01); C23C 16/455 (2006.01); G01B 17/02 (2006.01); H01L 21/66 (2006.01); C23C 14/04 (2006.01); C23C 14/12 (2006.01)
CPC H01L 21/67253 (2013.01) [C23C 14/546 (2013.01); C23C 16/45565 (2013.01); G01B 17/025 (2013.01); H01L 21/6719 (2013.01); H01L 22/12 (2013.01); C23C 14/042 (2013.01); C23C 14/12 (2013.01)] 18 Claims
OG exemplary drawing
 
1. A process chamber comprising:
a chamber body;
a substrate support disposed in the chamber body;
a lid disposed over the chamber body; and
a sensor assembly coupled to the chamber body at a lower portion of the sensor assembly, the sensor assembly coupled to the lid at an upper portion of the sensor assembly, the sensor assembly further comprising:
one or more apertures disposed through one or more sides of the sensor assembly;
one or more sensors disposed in the sensor assembly through the one or more of the apertures; and
a shelf, the shelf comprising grooves substantially aligned with the one or more apertures and configured to receive each of the one or more sensors.