US 11,721,562 B2
Substrate bonding apparatus
Hyungjun Jeon, Seoul (KR); Taeyeong Kim, Yongin-si (KR); Hoechul Kim, Seoul (KR); and Junhong Min, Ulsan (KR)
Assigned to SAMSUNG ELECTRONICS CO., LTD., Suwon-si (KR)
Filed by Samsung Electronics Co., Ltd., Suwon-si (KR)
Filed on Sep. 8, 2020, as Appl. No. 17/14,335.
Claims priority of application No. 10-2019-0141901 (KR), filed on Nov. 7, 2019.
Prior Publication US 2021/0143026 A1, May 13, 2021
Int. Cl. H01L 21/00 (2006.01); B32B 37/00 (2006.01); B32B 41/00 (2006.01); H01L 21/67 (2006.01); H01L 23/00 (2006.01); H01L 21/687 (2006.01); H01L 25/00 (2006.01); H01L 27/146 (2006.01); H01L 21/683 (2006.01)
CPC H01L 21/67017 (2013.01) [B32B 37/003 (2013.01); B32B 37/0046 (2013.01); B32B 41/00 (2013.01); H01L 21/67092 (2013.01); H01L 24/74 (2013.01); B32B 2309/02 (2013.01); B32B 2309/12 (2013.01); B32B 2309/60 (2013.01); B32B 2457/14 (2013.01); H01L 21/6838 (2013.01); H01L 21/68742 (2013.01); H01L 25/50 (2013.01); H01L 27/1469 (2013.01)] 8 Claims
OG exemplary drawing
 
1. A substrate bonding apparatus for bonding a first substrate to a second substrate, the substrate bonding apparatus comprising:
a first bonding chuck configured to fix the first substrate to a first surface of the first bonding chuck;
a second bonding chuck configured to fix the second substrate to a second surface of the second bonding chuck, the second surface facing the first surface;
a process gas injector surrounding at least one selected from the first bonding chuck and the second bonding chuck in a plan view, the process gas injector configured to inject a process gas between the first substrate and the second substrate when respectively disposed on the first bonding chuck and the second bonding chuck; and
an air curtain generator disposed at an outside of the process gas injector in the plan view, the air curtain generator configured to inject an air curtain forming gas to form an air curtain surrounding the first substrate and the second substrate.