CPC H01J 37/32678 (2013.01) [C23C 14/357 (2013.01); C23C 16/511 (2013.01); H01J 27/18 (2013.01); H01J 37/3222 (2013.01); H01J 37/32192 (2013.01); H01J 37/32201 (2013.01); H01J 37/32238 (2013.01); H01J 37/32247 (2013.01); H01J 37/32266 (2013.01); H01J 37/32669 (2013.01); H01J 37/32935 (2013.01); H05H 1/46 (2013.01)] | 10 Claims |
1. A plasma processing tool, comprising:
a processing chamber confining a processing volume; and
a plurality of modular microwave sources coupled to the processing chamber, wherein the plurality of modular microwave sources comprise:
an array of applicators positioned over a dielectric that forms a portion of an outer wall of the processing chamber, wherein each applicator of the array of applicators is in a first plane, and the dielectric is in a second plane, the second plane parallel with the first plane;
an array of microwave amplification modules, wherein each microwave amplification module is coupled to one or more of the applicators in the array of applicators; and
a plurality of magnets, wherein each of the plurality of magnets laterally surrounds a corresponding applicator of the array of applicators in the first plane, and wherein the plurality of magnets are electrically coupled to each other in series in the first plane.
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