US 11,721,491 B2
Multilayer electronic component
Jun Il Song, Suwon-si (KR); Sang Won Choi, Suwon-si (KR); Seung Heui Lee, Suwon-si (KR); and Su Min Shin, Suwon-si (KR)
Assigned to SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si (KR)
Filed by SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si (KR)
Filed on Oct. 20, 2021, as Appl. No. 17/506,072.
Claims priority of application No. 10-2020-0183841 (KR), filed on Dec. 24, 2020.
Prior Publication US 2022/0208471 A1, Jun. 30, 2022
Int. Cl. H01G 4/30 (2006.01); H01G 4/008 (2006.01); H01G 4/12 (2006.01); H01G 4/012 (2006.01)
CPC H01G 4/30 (2013.01) [H01G 4/008 (2013.01); H01G 4/012 (2013.01); H01G 4/1218 (2013.01)] 13 Claims
OG exemplary drawing
 
1. A multilayer electronic component comprising:
a body including dielectric layers and internal electrodes alternately disposed with the dielectric layers; and
external electrodes disposed on the body,
wherein one of the internal electrodes includes interfacial portions disposed at interfaces thereof with two of the dielectric layers, between which the one of the internal electrodes is disposed, and a central portion disposed between the interfacial portions, and
one of the interfacial portions has a Mn content higher than an average Mn content of the central portion and an average Mn content of one of the dielectric layers which is in contact with the one of the interfacial portions.