US 11,721,482 B2
Method of producing ceramic electronic component and ceramic electronic component
Takashi Sawada, Nagaokakyo (JP); and Kenichi Togo, Nagaokakyo (JP)
Assigned to MURATA MANUFACTURING CO., LTD., Kyoto (JP)
Filed by Murata Manufacturing Co., Ltd., Nagaokakyo (JP)
Filed on Jul. 31, 2020, as Appl. No. 16/944,191.
Claims priority of application No. 2019-174476 (JP), filed on Sep. 25, 2019.
Prior Publication US 2021/0090801 A1, Mar. 25, 2021
Int. Cl. H01G 4/12 (2006.01); H01G 4/224 (2006.01); H01G 4/008 (2006.01)
CPC H01G 4/1209 (2013.01) [H01G 4/008 (2013.01); H01G 4/224 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A method of producing a ceramic electronic component, comprising:
baking a first electrode paste containing a metal powder at a first temperature to form a first electrode layer at a first region of a ceramic body;
baking a second electrode paste containing a metal powder of a same type as the metal powder in the first electrode paste at a second temperature lower than the first temperature to form a second electrode layer at a second region different from the first region of the ceramic body; and
applying a physical shock treatment to a surface of the second electrode layer to densify a surface layer portion of the second electrode layer; wherein
the applying the physical shock treatment includes the physical shock treatment being applied to only the surface of the second electrode layer.