US 11,721,480 B2
Multilayer electronic component
Ho In Jun, Suwon-si (KR); Kyeong Jun Kim, Suwon-si (KR); Jin Sung Chun, Suwon-si (KR); Woo Chul Shin, Suwon-si (KR); and Seul Gi Kim, Suwon-si (KR)
Assigned to SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si (KR)
Filed by SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si (KR)
Filed on Feb. 18, 2022, as Appl. No. 17/675,283.
Application 17/675,283 is a continuation of application No. 16/776,610, filed on Jan. 30, 2020, granted, now 11,289,270.
Claims priority of application No. 10-2019-0103792 (KR), filed on Aug. 23, 2019.
Prior Publication US 2022/0172892 A1, Jun. 2, 2022
This patent is subject to a terminal disclaimer.
Int. Cl. H01G 4/008 (2006.01); H01G 4/232 (2006.01); H01G 4/012 (2006.01); H01G 4/30 (2006.01)
CPC H01G 4/008 (2013.01) [H01G 4/012 (2013.01); H01G 4/232 (2013.01); H01G 4/30 (2013.01)] 18 Claims
OG exemplary drawing
 
1. A multilayer electronic component comprising:
a body including a dielectric layer and an internal electrode; and
an external electrode including an electrode layer disposed on the body and connected to the internal electrode through a surface of the body, a first plating layer disposed on the electrode layer, and a conductive resin layer disposed on the first plating layer,
wherein the electrode layer includes Cu and glass, the first plating layer includes a Cu plating layer, and the conductive resin layer includes a conductive metal and a base resin, and
wherein the first plating layer has surface roughness at an interface with the conductive resin layer, and the first plating layer comprises an oxide containing Cu in a region having the surface roughness.