US 11,721,473 B2
Coil component
Joung Gul Ryu, Suwon-si (KR); Ji Man Ryu, Suwon-si (KR); and Byeong Cheol Moon, Suwon-si (KR)
Assigned to SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si (KR)
Filed by SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si (KR)
Filed on Aug. 26, 2019, as Appl. No. 16/550,877.
Claims priority of application No. 10-2018-0122107 (KR), filed on Oct. 12, 2018.
Prior Publication US 2020/0118730 A1, Apr. 16, 2020
Int. Cl. H01F 5/00 (2006.01); H01F 27/28 (2006.01); H01F 27/32 (2006.01); H01F 27/29 (2006.01)
CPC H01F 27/2804 (2013.01) [H01F 27/323 (2013.01); H01F 27/29 (2013.01); H01F 2027/2809 (2013.01)] 19 Claims
OG exemplary drawing
 
1. A coil component comprising:
a body;
an insulating substrate, embedded in the body, including an insulating resin;
first and second substrate protection layers covering respective surfaces of the insulating substrate to protect the insulating substrate and including a ceramic;
a coil portion including first and second coil patterns respectively disposed on the first and second substrate protection layers; and
an insulating layer covering the first and second coil patterns, the first and second substrate protection layers, and a side surface of the insulating substrate,
wherein each of the first and second coil patterns includes a first conductive layer, disposed on the respective first or second substrate protection layer, and a second conductive layer disposed on the first conductive layer to expose a side surface of the first conductive layer.