CPC H01F 27/2804 (2013.01) [H01F 27/323 (2013.01); H01F 27/29 (2013.01); H01F 2027/2809 (2013.01)] | 19 Claims |
1. A coil component comprising:
a body;
an insulating substrate, embedded in the body, including an insulating resin;
first and second substrate protection layers covering respective surfaces of the insulating substrate to protect the insulating substrate and including a ceramic;
a coil portion including first and second coil patterns respectively disposed on the first and second substrate protection layers; and
an insulating layer covering the first and second coil patterns, the first and second substrate protection layers, and a side surface of the insulating substrate,
wherein each of the first and second coil patterns includes a first conductive layer, disposed on the respective first or second substrate protection layer, and a second conductive layer disposed on the first conductive layer to expose a side surface of the first conductive layer.
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