CPC H01F 17/04 (2013.01) [H01F 1/06 (2013.01); H01F 1/14 (2013.01); H01F 1/26 (2013.01); H01F 27/255 (2013.01); H01F 27/292 (2013.01); H01F 41/04 (2013.01); H01F 41/046 (2013.01); H01F 41/10 (2013.01); H01F 17/0006 (2013.01); H01F 2017/0066 (2013.01); H01F 2017/048 (2013.01); Y10T 428/32 (2015.01)] | 20 Claims |
1. An electronic component, comprising:
a composite body composed of a composite material of a resin and a magnetic metal powder; and
a metal film disposed on an outer surface of the composite body,
the magnetic metal powder containing Fe,
the metal film mainly containing Ni, and further containing at least one of P or Fe, and being in contact with the resin and the magnetic metal powder.
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