US 11,720,726 B1
Systems and methods of simulating drop shock reliability of solder joints with a multi-scale model
Cheng-Tang Wu, Livermore, CA (US); Wei Hu, Mountain View, CA (US); Dandan Lyu, Dublin, CA (US); Siddharth Shah, Irvine, CA (US); and Ashutosh Srivastava, Mountain View, CA (US)
Assigned to ANSYS Inc., Canonsburg, PA (US)
Filed by ANSYS, Inc., Canonsburg, PA (US)
Filed on Oct. 29, 2020, as Appl. No. 17/84,367.
Claims priority of provisional application 63/056,418, filed on Jul. 24, 2020.
Int. Cl. G06F 30/20 (2020.01); G06F 119/02 (2020.01); G06F 115/12 (2020.01); G06F 111/04 (2020.01); G06F 30/25 (2020.01); G06F 119/22 (2020.01); G06F 30/28 (2020.01); G06F 111/00 (2020.01)
CPC G06F 30/20 (2020.01) [G06F 30/25 (2020.01); G06F 30/28 (2020.01); G06F 2111/00 (2020.01); G06F 2111/04 (2020.01); G06F 2115/12 (2020.01); G06F 2119/02 (2020.01); G06F 2119/22 (2020.01)] 16 Claims
OG exemplary drawing
 
1. A computer-implemented method comprising:
receiving a computer aided engineering (CAE) model for representing an electronic product that contains a solder joint, the CAE model indicating a location of the solder joint in the electronic product;
generating a solder joint model to represent the solder joint, the solder joint model coupled with the CAE model via the location, the electronic product represented based on the CAE model coupled with the solder joint model; and
performing simulation of physical behaviors of the electronic product using the CAE model in a first time scale and the solder joint model in a second time scale, the CAE model simulated with the first time step of the first time scale, the solder joint model simulated with a second time step of the second time scale, the first time step larger than the second time step, the CAE model and the solder joint model co-simulated with a set of constraints synchronized periodically between the CAE model and the solder model.