US 11,720,033 B2
Material management method and system
Rong-Syuan Fan, Hsinchu (TW); Ching-Jung Chang, Hsinchu (TW); Chi-Feng Tung, Hsinchu (TW); and Hsiang-Yin Shen, Hsinchu (TW)
Assigned to Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu (TW)
Filed by Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu (TW)
Filed on Sep. 15, 2021, as Appl. No. 17/476,420.
Claims priority of provisional application 63/157,066, filed on Mar. 5, 2021.
Prior Publication US 2022/0283520 A1, Sep. 8, 2022
Int. Cl. G03F 7/20 (2006.01); G03F 7/00 (2006.01)
CPC G03F 7/70858 (2013.01) 20 Claims
OG exemplary drawing
 
1. A method, comprising:
storing a carrier containing photoresist in a storage, a first temperature of the storage being less than about 0° C.;
recording first environmental data and first safety data associated with the photoresist by a transport vehicle that transits the carrier from a materials supplier to the storage;
recording second environmental data of the storage to a database while the photoresist is in the storage;
recording second safety data of the carrier to the database while the photoresist is in the storage;
recording acclimation time of the photoresist at a staging area having a second temperature of about 20° C. to about 25° C.;
generating a forecast of expiration of the photoresist based on the first environmental data, the second environmental data, the first safety data, the second safety data and the acclimation time;
receiving a request for the photoresist from a semiconductor fabrication tool; and
providing the carrier to the semiconductor fabrication tool based on the forecasted expiration of the photoresist.