CPC G01R 33/091 (2013.01) [G01R 33/0283 (2013.01); G01R 33/07 (2013.01); G01R 33/0017 (2013.01)] | 20 Claims |
1. A sensor die, comprising:
a set of sensing elements; and
a test structure associated with determining a magnetic sensitivity of the set of sensing elements, the test structure including:
at least one first test sensing element, associated with determining the magnetic sensitivity of the set of sensing elements and that is different from the set of sensing elements, sensitive in a first direction in a plane defined by a surface of the sensor die,
at least one second test sensing element, associated with determining the magnetic sensitivity of the set of sensing elements and that is different from the set of sensing elements, sensitive in the first direction in the plane defined by the surface of the sensor die, and
a wire on chip (WoC) associated with applying a magnetic field to the at least one first test sensing element and to the at least one second test sensing element,
wherein the at least one first test sensing element, the at least one second test sensing element, and the WoC are arranged such that when current flows through the WoC:
a component of the magnetic field in the first direction is applied to the at least one first test sensing element, and
a component of the magnetic field in a second direction that is perpendicular to the first direction is applied to the at least one second test sensing element.
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