CPC G01R 31/2865 (2013.01) [G01R 1/16 (2013.01); G01R 31/2887 (2013.01); G01R 31/2891 (2013.01); G11C 11/16 (2013.01); G11C 11/1673 (2013.01); G11C 11/1675 (2013.01); G11C 29/56016 (2013.01); G11C 2029/5602 (2013.01)] | 20 Claims |
1. A semiconductor wafer testing system, comprising:
a wafer chuck support structure;
a ferromagnetic wafer chuck disposed on the wafer chuck support structure, wherein the ferromagnetic wafer chuck is configured to hold a semiconductor wafer comprising an integrated chip (IC), wherein the ferromagnetic wafer chuck has a chemical composition from an upper surface of the ferromagnetic wafer chuck to a lower surface of the ferromagnetic wafer chuck, and wherein the chemical composition comprises about 99.9% of a ferromagnetic material; and
a magnet configured to generate an external magnetic field, wherein the ferromagnetic wafer chuck is configured to amplify the external magnetic field so that the external magnetic field passes through the IC with an amplified magnetic field strength.
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