US 11,719,742 B2
Semiconductor wafer testing system and related method for improving external magnetic field wafer testing
Harry-Hak-Lay Chuang, Zhubei (TW); Chih-Yang Chang, Hsinchu (TW); Ching-Huang Wang, Pingjhen (TW); Tien-Wei Chiang, Taipei (TW); Meng-Chun Shih, Hsinchu (TW); and Chia Yu Wang, Hsinchu County (TW)
Assigned to Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu (TW)
Filed by Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu (TW)
Filed on Aug. 8, 2022, as Appl. No. 17/882,827.
Application 17/882,827 is a continuation of application No. 17/126,222, filed on Dec. 18, 2020, granted, now 11,506,706.
Application 17/126,222 is a continuation of application No. 16/411,647, filed on May 14, 2019, granted, now 10,877,089.
Claims priority of provisional application 62/735,271, filed on Sep. 24, 2018.
Prior Publication US 2022/0373594 A1, Nov. 24, 2022
This patent is subject to a terminal disclaimer.
Int. Cl. G01R 31/26 (2020.01); G01R 31/28 (2006.01); G11C 11/16 (2006.01); G01R 1/16 (2006.01); G11C 29/56 (2006.01)
CPC G01R 31/2865 (2013.01) [G01R 1/16 (2013.01); G01R 31/2887 (2013.01); G01R 31/2891 (2013.01); G11C 11/16 (2013.01); G11C 11/1673 (2013.01); G11C 11/1675 (2013.01); G11C 29/56016 (2013.01); G11C 2029/5602 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A semiconductor wafer testing system, comprising:
a wafer chuck support structure;
a ferromagnetic wafer chuck disposed on the wafer chuck support structure, wherein the ferromagnetic wafer chuck is configured to hold a semiconductor wafer comprising an integrated chip (IC), wherein the ferromagnetic wafer chuck has a chemical composition from an upper surface of the ferromagnetic wafer chuck to a lower surface of the ferromagnetic wafer chuck, and wherein the chemical composition comprises about 99.9% of a ferromagnetic material; and
a magnet configured to generate an external magnetic field, wherein the ferromagnetic wafer chuck is configured to amplify the external magnetic field so that the external magnetic field passes through the IC with an amplified magnetic field strength.