US 11,719,579 B2
Wearable infrared temperature sensing device
Chih-Ming Sun, Hsin-Chu (TW); Ming-Han Tsai, Hsin-Chu (TW); and Cheng-Nan Tsai, Hsin-Chu (TW)
Assigned to PIXART IMAGING INC., Hsin-Chu (TW)
Filed by PIXART IMAGING INC., Hsin-Chu (TW)
Filed on Jan. 19, 2022, as Appl. No. 17/578,691.
Application 17/578,691 is a continuation of application No. 16/850,187, filed on Apr. 16, 2020, granted, now 11,268,859.
Application 16/850,187 is a continuation of application No. 16/194,212, filed on Nov. 16, 2018, granted, now 10,670,465, issued on Jun. 2, 2020.
Application 16/194,212 is a continuation of application No. 15/172,983, filed on Jun. 3, 2016, granted, now 10,168,220, issued on Jan. 1, 2019.
Application 15/172,983 is a continuation in part of application No. 14/726,472, filed on May 30, 2015, granted, now 10,168,219, issued on Jan. 1, 2019.
Claims priority of application No. 104108897 (TW), filed on Mar. 20, 2015; and application No. 105108127 (TW), filed on Mar. 16, 2016.
Prior Publication US 2022/0136905 A1, May 5, 2022
This patent is subject to a terminal disclaimer.
Int. Cl. G01J 5/02 (2022.01); B81B 7/00 (2006.01); G01J 5/04 (2006.01); H04N 5/33 (2023.01); G01J 5/06 (2022.01); H04N 23/57 (2023.01)
CPC G01J 5/0265 (2013.01) [B81B 7/0064 (2013.01); B81B 7/0067 (2013.01); G01J 5/041 (2013.01); G01J 5/045 (2013.01); G01J 5/06 (2013.01); H04N 5/33 (2013.01); H04N 23/57 (2023.01); B81B 2201/0278 (2013.01)] 9 Claims
OG exemplary drawing
 
1. A wearable device, comprising:
a case having a first opening; and
a far infrared temperature sensing device disposed inside the case of the wearable device, and the far infrared temperature sensing device including:
a first substrate;
a sensor chip which is disposed on the first substrate; and
a metal shielding structure which is disposed on the first substrate and surrounds the sensor chip, wherein the metal shielding structure has a second opening.