US 11,719,490 B2
Loop heat pipe with recessed outer wall surface
Yoshihiro Machida, Nagano (JP)
Assigned to SHINKO ELECTRIC INDUSTRIES CO., LTD., Nagano (JP)
Filed by SHINKO ELECTRIC INDUSTRIES CO., LTD., Nagano (JP)
Filed on Sep. 24, 2020, as Appl. No. 17/30,930.
Claims priority of application No. 2019-198357 (JP), filed on Oct. 31, 2019.
Prior Publication US 2021/0131742 A1, May 6, 2021
Int. Cl. F28D 15/00 (2006.01); F28D 15/02 (2006.01)
CPC F28D 15/0266 (2013.01) 20 Claims
OG exemplary drawing
 
1. A loop heat pipe comprising:
an evaporator configured to vaporizes a working fluid;
a condenser configured to liquefy the working fluid;
a liquid pipe configured to connect the evaporator and the condenser; and
a vapor pipe configured to connect the evaporator and the condenser, and forms a loop-shaped passage together with the liquid pipe, wherein
each of the evaporator, the condenser, the liquid pipe, and the vapor pipe includes a plurality of laminated metal layers forming a pair of pipe walls of the evaporator, the condenser, the liquid pipe, and the vapor pipe, respectively,
each of the pair of pipe walls has an outer wall surface formed by an outer side surface of each of the plurality of laminated metal layers, and
one of the plurality of laminated metal layers includes a recess, caving in from one of two opposite principal surfaces thereof toward an approximate center along a thickness direction thereof, at the outer wall surface of each of the pair of pipe walls.