CPC C25D 5/003 (2013.01) [C25D 5/06 (2013.01); C25D 17/002 (2013.01); C25D 17/14 (2013.01); C25D 21/12 (2013.01)] | 3 Claims |
1. A film forming method for forming a metal film from metal ions contained in an electrolytic solution on a surface of a substrate by depositing metal on the surface of the substrate by electroplating or electroless plating, the film forming method comprising at least:
placing the substrate on a mount base;
while sucking a gas between the substrate and a porous film from a suction port of a suction passage formed on the mount base, the suction passage connecting a suction pump to the suction port, moving the porous film toward the substrate and bringing the porous film into contact with the surface of the substrate;
stopping suction from the suction pump in the suction passage in a state where the porous film is in contact with the surface of the substrate; and
in a state where suction in the suction passage is stopped, allowing the electrolytic solution to pass through the porous film while the porous film is pressed against the substrate with a fluid pressure of the electrolytic solution and depositing the metal from the metal ions contained in the passed electrolytic solution on the surface of the substrate, thereby forming the metal film on the surface of the substrate.
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