US 11,718,923 B2
Film forming method for forming metal film and film forming apparatus for forming metal film
Yuki Sato, Nagoya (JP)
Assigned to TOYOTA JIDOSHA KABUSHIKI KAISHA, Toyota (JP)
Filed by TOYOTA JIDOSHA KABUSHIKI KAISHA, Toyota (JP)
Filed on May 31, 2022, as Appl. No. 17/804,717.
Claims priority of application No. 2021-092162 (JP), filed on Jun. 1, 2021.
Prior Publication US 2022/0380923 A1, Dec. 1, 2022
Int. Cl. C25D 5/06 (2006.01); C25D 17/14 (2006.01); C25D 5/00 (2006.01); C25D 21/12 (2006.01); C25D 17/00 (2006.01)
CPC C25D 5/003 (2013.01) [C25D 5/06 (2013.01); C25D 17/002 (2013.01); C25D 17/14 (2013.01); C25D 21/12 (2013.01)] 3 Claims
OG exemplary drawing
 
1. A film forming method for forming a metal film from metal ions contained in an electrolytic solution on a surface of a substrate by depositing metal on the surface of the substrate by electroplating or electroless plating, the film forming method comprising at least:
placing the substrate on a mount base;
while sucking a gas between the substrate and a porous film from a suction port of a suction passage formed on the mount base, the suction passage connecting a suction pump to the suction port, moving the porous film toward the substrate and bringing the porous film into contact with the surface of the substrate;
stopping suction from the suction pump in the suction passage in a state where the porous film is in contact with the surface of the substrate; and
in a state where suction in the suction passage is stopped, allowing the electrolytic solution to pass through the porous film while the porous film is pressed against the substrate with a fluid pressure of the electrolytic solution and depositing the metal from the metal ions contained in the passed electrolytic solution on the surface of the substrate, thereby forming the metal film on the surface of the substrate.