US 11,718,916 B2
Electroless Co—W plating film
Shoji Iguchi, Aichi (JP); Akio Itamura, Aichi (JP); Shoichi Fukui, Aichi (JP); Yukinori Oda, Osaka (JP); Masaaki Sato, Osaka (JP); Yoshihito Il, Osaka (JP); and Hiroki Okubo, Osaka (JP)
Assigned to C. UYEMURA & CO., LTD., Osaka (JP)
Filed by C. Uyemura & Co., Ltd., Osaka (JP)
Filed on May 23, 2022, as Appl. No. 17/750,660.
Claims priority of application No. 2021-089256 (JP), filed on May 27, 2021; application No. 2022-014117 (JP), filed on Feb. 1, 2022; and application No. 2022-070732 (JP), filed on Apr. 22, 2022.
Prior Publication US 2022/0389587 A1, Dec. 8, 2022
Int. Cl. C23C 18/32 (2006.01); C23C 18/00 (2006.01); C23C 30/00 (2006.01); C22C 19/00 (2006.01); C22C 19/07 (2006.01); B32B 15/04 (2006.01); C23C 18/36 (2006.01); C23C 18/34 (2006.01); C23C 18/54 (2006.01); C23C 18/50 (2006.01); C23C 18/48 (2006.01); C23C 18/18 (2006.01)
CPC C23C 18/32 (2013.01) [B32B 15/04 (2013.01); B32B 15/043 (2013.01); C22C 19/00 (2013.01); C22C 19/07 (2013.01); C23C 18/34 (2013.01); C23C 18/36 (2013.01); C23C 18/48 (2013.01); C23C 18/50 (2013.01); C23C 18/54 (2013.01); C23C 30/00 (2013.01); C23C 30/005 (2013.01); C23C 18/1844 (2013.01); Y10T 428/1284 (2015.01); Y10T 428/1291 (2015.01); Y10T 428/12931 (2015.01); Y10T 428/12937 (2015.01); Y10T 428/12944 (2015.01); Y10T 428/2495 (2015.01); Y10T 428/24967 (2015.01); Y10T 428/24975 (2015.01); Y10T 428/265 (2015.01)] 7 Claims
OG exemplary drawing
 
1. An electroless Co—W plating film, wherein
the film is non-crystalline;
a content of W is in an amount of 35 to 58 mass %; and
a thickness of the film is 0.05 μm or more.