US 11,718,904 B2
Mask arrangement for masking a substrate in a processing chamber, apparatus for depositing a layer on a substrate, and method for aligning a mask arrangement for masking a substrate in a processing chamber
Stefan Bangert, Steinau (DE); Tommaso Vercesi, Aschaffenburg (DE); Daniele Gislon, Santa Maria di Sala-Venice (IT); Oliver Heimel, Wabern (DE); Andreas Lopp, Freigericht (DE); and Dieter Haas, San Jose, CA (US)
Assigned to Applied Materials, Inc., Santa Clara, CA (US)
Filed by Applied Materials, Inc., Santa Clara, CA (US)
Filed on Jun. 26, 2019, as Appl. No. 16/422,794.
Application 16/422,794 is a continuation of application No. 15/534,826, abandoned, previously published as PCT/EP2014/077257, filed on Dec. 10, 2014.
Prior Publication US 2019/0301002 A1, Oct. 3, 2019
Int. Cl. H01L 21/67 (2006.01); C23C 14/04 (2006.01); C23C 16/04 (2006.01); C23C 16/458 (2006.01); G03F 1/38 (2012.01); C23C 14/56 (2006.01); H01L 21/673 (2006.01); H01L 21/677 (2006.01); G01F 1/42 (2006.01); H10K 71/16 (2023.01)
CPC C23C 14/042 (2013.01) [C23C 14/56 (2013.01); C23C 16/042 (2013.01); C23C 16/4587 (2013.01); G03F 1/38 (2013.01); H01L 21/67346 (2013.01); H01L 21/67712 (2013.01); G01F 1/42 (2013.01); H10K 71/166 (2023.02)] 23 Claims
OG exemplary drawing
 
1. An apparatus for forming a pattern of deposited material on a substrate, comprising:
a mask arrangement, comprising:
a mask frame;
a mask device coupled to and supported by the mask frame, wherein the mask device is configured to be disposed between the substrate and a deposition source within a processing chamber, and the mask device extending in a first direction that is at an acute angle to a second direction that is parallel to a force of gravity;
an actuator configured to apply a gravity compensation force to the mask frame, wherein the gravity compensation force comprises a force that is applied in the first direction to the mask frame to compensate or correct for a deformation of the mask frame and the mask device caused by the force of gravity;
a carrier having a first surface that is configured to support the mask arrangement and is parallel to the first direction; and
a transport device that is configured to transport the mask arrangement and carrier for a process of forming the pattern of deposited material on the substrate.