US 11,718,802 B2
Temperature profile in an advanced thermal treatment apparatus and method
Daniel Michael Donegan, Hatfield Peverel (GB)
Assigned to STANDARD GAS LIMITED, London (GB)
Filed by STANDARD GAS LIMITED, London (GB)
Filed on Sep. 3, 2021, as Appl. No. 17/466,886.
Application 17/466,886 is a division of application No. 16/680,295, filed on Nov. 11, 2019, granted, now 11,136,515.
Application 16/680,295 is a continuation of application No. 15/554,628, abandoned, previously published as PCT/GB2016/050583, filed on Mar. 4, 2016.
Claims priority of application No. 1503772 (GB), filed on Mar. 5, 2015.
Prior Publication US 2021/0395626 A1, Dec. 23, 2021
Int. Cl. C10J 3/72 (2006.01); F23G 5/027 (2006.01); F23G 5/20 (2006.01); C10J 3/00 (2006.01); C10K 3/00 (2006.01); C10B 1/10 (2006.01); C10B 47/30 (2006.01)
CPC C10J 3/721 (2013.01) [C10B 1/10 (2013.01); C10B 47/30 (2013.01); C10J 3/005 (2013.01); C10K 3/001 (2013.01); F23G 5/0273 (2013.01); F23G 5/20 (2013.01); C10J 2300/12 (2013.01); C10J 2300/1223 (2013.01); C10J 2300/1246 (2013.01); C10J 2300/1253 (2013.01); F23G 2203/20 (2013.01); F23G 2209/22 (2013.01); F23G 2209/26 (2013.01); F23G 2209/28 (2013.01); F23G 2900/50201 (2013.01)] 19 Claims
OG exemplary drawing
 
1. An advanced thermal treatment (ATT) method comprising:
applying heat from a heat source to a first region to cause a first advanced thermal treatment (ATT) process, the first ATT process resulting in a gaseous mixture;
applying heat from the heat source to a second region in the form of a gas enclosure to cause a second ATT process, the second ATT process being applied to a gaseous mixture received from a third region, the gas enclosure having a diameter less than the first region; and
applying heat from the heat source to the third region, coupled in between the first region and the second region, to cause a third ATT process, the third ATT process being applied to the gaseous mixture received from the first region, wherein the third region has a diameter smaller than the first region.