US 11,718,519 B2
Packaged environmental sensor
Marco Omar Ghidoni, Melzo (IT)
Assigned to STMICROELECTRONICS S.r.l., Agrate Brianza (IT)
Filed by STMicroelectronics S.r.l., Agrate Brianza (IT)
Filed on Nov. 24, 2020, as Appl. No. 17/102,973.
Claims priority of application No. 102019000022503 (IT), filed on Nov. 29, 2019.
Prior Publication US 2021/0163283 A1, Jun. 3, 2021
Int. Cl. B81B 7/00 (2006.01); B81B 7/02 (2006.01); B81C 1/00 (2006.01)
CPC B81B 7/0058 (2013.01) [B81B 2201/0264 (2013.01); B81B 2201/0278 (2013.01); B81B 2201/0292 (2013.01); B81B 2207/012 (2013.01); B81B 2207/07 (2013.01); B81B 2207/092 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A packaged environmental sensor, comprising:
a supporting structure;
a sensor die, incorporating an environmental sensor and arranged on a first side of the supporting structure;
a control chip, coupled to the sensor die and arranged on a second side of the supporting structure opposite to the first side; and
a ring shaped lid bonded to the first side of the supporting structure, the ring shaped lid being in fluid communication with an environment outside and external to the ring shaped lid, and
wherein the sensor die is housed inside the ring shaped lid.
 
14. An electronic system, comprising:
a casing;
a processing unit within the casing; and
a packaged environmental sensor coupled to the processing unit, the packaged environmental sensor including:
a supporting structure;
a sensor die, incorporating an environmental sensor and arranged on a first side of the supporting structure;
a control chip, coupled to the sensor die and arranged on a second side of the supporting structure opposite to the first side; and
a ring shaped lid bonded to the first side of the supporting structure, the ring shaped lid being in fluid communication with an environment outside and external to the ring shaped lid, and
wherein the sensor die is housed inside the ring or collar shaped lid.
 
16. A device, comprising:
a supporting structure having a first side and a second side opposite to the first side, the supporting structure defining a cavity extending into the supporting structure from the second side;
a sensor die, incorporating an environmental sensor and arranged on the first side of the supporting structure;
a control chip, coupled to the sensor die, disposed within the cavity, and attached to and arranged on the second side of the supporting structure; and
a ring or collar shaped lid attached to the first side of the supporting structure, the ring shaped lid in fluid communication with an environment outside and external to the ring shaped lid, the sensor die being housed within the ring shaped lid attached to the first side of the supporting structure.