CPC B41F 15/46 (2013.01) [B41F 15/42 (2013.01); H05K 3/1233 (2013.01); H05K 3/3485 (2020.08); H05K 2203/0139 (2013.01)] | 12 Claims |
1. A system for spreading a conductive paste across a stencil to apply the conductive paste to an underlying base in a stencil printing process, the system comprising:
a base having an upper surface;
a stencil removably covering at least a portion of the upper surface of the base, the stencil having a lower surface configured to removably contact the upper surface of the base, the stencil having an upper surface, and the stencil defining an opening extending therethrough from the upper surface of the stencil to the lower surface of the stencil; and
a squeegee configured to spread a conductive paste across the upper surface of the stencil, wherein the squeegee has a leading surface, a trailing surface, and a bottom surface connecting the leading surface to the trailing surface, wherein the bottom surface is oriented at an oblique angle relative to the leading surface and the trailing surface;
wherein the bottom surface and the trailing surface intersect at a corner that defines a lower-most point of the squeegee;
wherein the bottom surface and the trailing surface intersect at an angle between 15 degrees and 45 degrees.
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