US 11,718,024 B2
3-D printing
Shannon Reuben Woodruff, San Diego, CA (US); Ali Emamjomeh, San Diego, CA (US); Yi Feng, San Diego, CA (US); Erica Fung, San Diego, CA (US); Carolin Fleischmann, San Diego, CA (US); and Geoffrey Schmid, San Diego, CA (US)
Assigned to Hewlett-Packard Development Company, L.P., Spring, TX (US)
Filed by HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P., Spring, TX (US)
Filed on Dec. 23, 2021, as Appl. No. 17/561,059.
Application 17/561,059 is a division of application No. 16/077,752, granted, now 11,235,521, previously published as PCT/US2017/042098, filed on Jul. 14, 2017.
Prior Publication US 2022/0111587 A1, Apr. 14, 2022
Int. Cl. B29C 64/165 (2017.01); B33Y 70/00 (2020.01); B33Y 10/00 (2015.01); B29K 67/00 (2006.01); B29K 77/00 (2006.01)
CPC B29C 64/165 (2017.08) [B33Y 70/00 (2014.12); B29K 2067/04 (2013.01); B29K 2077/00 (2013.01); B33Y 10/00 (2014.12)] 11 Claims
OG exemplary drawing
 
1. A material set, comprising:
a build material for 3-D printing comprising particles of a polymer comprising polymer chains having at least one reactive group that is protected with a protecting group; and
an inkjet composition, comprising:
a de-protecting agent for removal of the protecting group; and
a liquid carrier.