US 11,718,004 B2
Molds having cooling behind insert technology and related methods
Tareq Haque, Dallas, TX (US); Gary Clark, Dallas, TX (US); and David Rys, Dallas, TX (US)
Assigned to Essilor International, Charenton-le-Pont (FR)
Appl. No. 16/976,596
Filed by Essilor International, Charenton-le-Pont (FR)
PCT Filed Mar. 1, 2019, PCT No. PCT/EP2019/055093
§ 371(c)(1), (2) Date Aug. 28, 2020,
PCT Pub. No. WO2019/166603, PCT Pub. Date Sep. 6, 2019.
Claims priority of application No. 18305220 (EP), filed on Mar. 1, 2018.
Prior Publication US 2020/0406518 A1, Dec. 31, 2020
Int. Cl. B29C 45/26 (2006.01); B29C 45/73 (2006.01); B29L 11/00 (2006.01)
CPC B29C 45/2673 (2013.01) [B29C 45/7312 (2013.01); B29C 45/7331 (2013.01); B29L 2011/0016 (2013.01)] 5 Claims
OG exemplary drawing
 
1. A mold comprising:
first and second mold portions, each having one or more recesses, the mold portions being movable relative to one another between an open position and a closed position in which each of the one or more recesses of the first mold portion cooperates with a respective one of the one or more recesses of the second mold portion to define one or more respective chambers, each of the one or more chambers comprises
a first cooling body coupled to the first mold portion, the first cooling body comprising a thermally-conductive material, and
a second cooling body coupled to the second mold portion, the second cooling body comprising a thermally-conductive material;
one or more first inserts each comprising silicon carbide, one of the one or more first inserts being configured to be removably coupled to the first cooling body; and one or more second inserts each comprising silicon carbide, one of the one or more second inserts being configured to be removably coupled to the second cooling body such that, when the first and second inserts are respectively removably coupled to the first and second cooling bodies, the first insert and the second insert cooperate to define a mold cavity within the chamber that is configured to receive a thermoplastic material,
wherein each of the first and second cooling bodies comprises opposing first and second faces and an inlet and an outlet, the first face of each of the first and second cooling bodies being coupled to one of the mold portions and the second face of each of the first and second cooling bodies being configured to be removably coupled to one of the first and second inserts, each of the first and second cooling bodies defining a fluid cavity closer to the second face than the first face, the fluid cavity being in fluid communication with the inlet and the outlet,
wherein the one or more chambers comprises two or more chambers, and
wherein for each of one or more sets of a plurality of the chambers:
the first cooling bodies are in fluid communication with one another via one or more first conduits, each of the one or more first conduits having a first diameter,
the second cooling bodies are in fluid communication with one another via one or more second conduits, each of the one or more second conduits having a second diameter that is larger than the first diameter,
each of the one or more second cooling bodies is movable within the respective recess of the second mold portion between a first position and a second position in which the second cooling body is closer to the face of the second mold portion than in the first position, the second position of the one or more second cooling bodies corresponding to a position to eject the thermoplastic material that is solidified, the second mold portion facing the first mold portion when the first and second mold portions are in the closed position,
the first cooling bodies are connected in parallel such that:
the inlet of each of the first cooling bodies is coupled to a common supply conduit in fluid communication with a fluid source, and
the outlet of each of the first cooling bodies is coupled to a common exhaust conduit in fluid communication with an exhaust, and
the second cooling bodies are connected in series such that:
a supply conduit in fluid communication with a fluid source is coupled to the inlet of one of the second cooling bodies,
an exhaust conduit in fluid communication with an exhaust is coupled to the outlet of one of the second cooling bodies, and
the one or more second conduits are disposed between the second cooling bodies such that when fluid flows from the supply conduit, the fluid flows consecutively through each of the second cooling bodies before flowing through the exhaust conduit.