CPC B29C 43/222 (2013.01) [A44B 18/0049 (2013.01); A44B 18/0065 (2013.01); A44B 18/0069 (2013.01); B29C 33/10 (2013.01); B29C 41/28 (2013.01); B29C 41/30 (2013.01); B29C 41/32 (2013.01); B29C 41/38 (2013.01); B29C 41/44 (2013.01); B29C 43/28 (2013.01); B29C 43/46 (2013.01); B29C 43/48 (2013.01); B29C 43/50 (2013.01); B29C 43/52 (2013.01); B29C 48/001 (2019.02); B29C 48/002 (2019.02); B29C 48/19 (2019.02); B32B 3/06 (2013.01); B32B 3/20 (2013.01); B32B 3/30 (2013.01); B32B 5/022 (2013.01); B32B 5/024 (2013.01); B32B 5/026 (2013.01); B32B 5/26 (2013.01); B32B 7/04 (2013.01); B32B 7/12 (2013.01); B32B 25/08 (2013.01); B32B 25/10 (2013.01); B32B 25/14 (2013.01); B32B 25/16 (2013.01); B32B 27/08 (2013.01); B32B 27/12 (2013.01); B32B 27/28 (2013.01); B32B 27/302 (2013.01); B32B 27/306 (2013.01); B32B 27/32 (2013.01); B32B 27/327 (2013.01); B32B 27/34 (2013.01); B32B 37/15 (2013.01); B29C 2043/461 (2013.01); B29C 2043/486 (2013.01); B29C 2791/001 (2013.01); B29K 2023/12 (2013.01); B29K 2101/12 (2013.01); B29K 2713/00 (2013.01); B29L 2031/729 (2013.01); B32B 27/36 (2013.01); B32B 37/0053 (2013.01); B32B 37/20 (2013.01); B32B 2037/0092 (2013.01); B32B 2250/03 (2013.01); B32B 2250/40 (2013.01); B32B 2262/023 (2013.01); B32B 2262/0215 (2013.01); B32B 2262/0223 (2013.01); B32B 2262/0253 (2013.01); B32B 2262/0261 (2013.01); B32B 2262/0276 (2013.01); B32B 2262/0284 (2013.01); B32B 2262/0292 (2013.01); B32B 2262/04 (2013.01); B32B 2262/062 (2013.01); B32B 2262/065 (2013.01); B32B 2307/718 (2013.01); B32B 2307/732 (2013.01); B32B 2309/02 (2013.01); B32B 2367/00 (2013.01); B32B 2435/00 (2013.01)] | 23 Claims |
1. A method for assembling an assembly comprising a tape of retaining elements and a substrate, said method comprising the following steps:
a step of forming a tape of retaining elements by dispensing a molding material into a molding device, so as to form a tape of retaining elements comprising a base presenting a bottom face and a top face, the top face of the base being provided with retaining elements; and
a step of applying a substrate against the bottom face of the base following the step of forming the tape and prior to said bottom face of the base solidifying in such a manner as to cause the substrate to penetrate at least in part beyond a plane defined by the bottom face of the base of the tape; wherein the substrate is applied against the bottom face of the base of the tape of retaining elements downstream from a location where the tape of retaining elements is formed with molding material dispenser means that form the tape and prior to said bottom face of the base solidifying,
wherein the molding device is a molding strip and the base of the tape is free from any increased thickness extending continuously along edges of the base of the tape.
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