US 11,717,980 B2
Ground detection system for ultrasonic cutting
Christopher Sean McCrory, Fort Worth, TX (US); Matthew Timothy McKee, Fort Worth, TX (US); Matthew Short, Wilmington, OH (US); and Lance Cronley, Mount Victory, OH (US)
Assigned to Lockheed Martin Corporation, Bethesda, MD (US)
Filed by Lockheed Martin Corporation, Bethesda, MD (US)
Filed on Jan. 8, 2020, as Appl. No. 16/737,008.
Prior Publication US 2021/0206015 A1, Jul. 8, 2021
Int. Cl. B26D 7/08 (2006.01); B26D 7/02 (2006.01)
CPC B26D 7/086 (2013.01) [B26D 7/025 (2013.01)] 7 Claims
OG exemplary drawing
 
1. A ground detection system, comprising:
an ultrasonic cutter configured to remove a portion of a surface coating from a substrate;
a power source;
a workpiece clamp configured to form an electrical connection between the ultrasonic cutter, the substrate, and the ground detection system; and
an electrical circuit comprising:
a controller;
a timer; and
a switch;
wherein the electrical circuit is configured to operate the switch to remove power from the ultrasonic cutter for an amount of time in response to the ultrasonic cutter contacting the substrate; and
wherein the amount of time that the power is removed from the ultrasonic cutter is provided by the timer.
 
5. A substrate detection system comprising:
an ultrasonic cutter configured to remove a portion of a surface coating from a substrate;
a workpiece clamp configured to form an electrical connection between the ultrasonic cutter, the substrate, and the substrate detection system; and
an electrical circuit configured to:
detect that the ultrasonic cutter has contacted the substrate;
remove power from the ultrasonic cutter for an amount of time in response to the ultrasonic cutter contacting the substrate; and
actuate an indicator to indicate that the ultrasonic cutter has contacted the substrate.