US 11,717,937 B2
Automatic polishing system
Keiji Manabe, Tokyo (JP); Hiroyuki Suzuki, Tokyo (JP); Hideo Shiwa, Tokyo (JP); and Genji Nakayama, Tokyo (JP)
Assigned to Taikisha Ltd., Tokyo (JP)
Appl. No. 16/486,875
Filed by Taikisha Ltd., Tokyo (JP)
PCT Filed Apr. 26, 2018, PCT No. PCT/JP2018/017030
§ 371(c)(1), (2) Date Aug. 19, 2019,
PCT Pub. No. WO2018/235430, PCT Pub. Date Dec. 27, 2018.
Claims priority of application No. JP2017-121582 (JP), filed on Jun. 21, 2017.
Prior Publication US 2020/0009705 A1, Jan. 9, 2020
Int. Cl. B24B 49/12 (2006.01); B25J 5/02 (2006.01); B25J 11/00 (2006.01); B25J 13/08 (2006.01); B25J 9/00 (2006.01)
CPC B24B 49/12 (2013.01) [B25J 5/02 (2013.01); B25J 9/0084 (2013.01); B25J 11/0065 (2013.01); B25J 13/08 (2013.01)] 9 Claims
OG exemplary drawing
 
1. An automatic polishing system comprising:
a polishing tool configured to polish a polishing subject face of a treatment subject;
a polishing robot configured to hold the polishing tool;
a three-dimensional shape measuring instrument for measuring a three-dimensional shape of the polishing subject face; and
a polishing controller for controlling the polishing robot to cause the polishing tool to polish the polishing subject face, based on three-dimensional shape data of the polishing subject face obtained by the three-dimensional shape measuring instrument;
wherein the polishing controller causes, when a plurality of protruding portions larger than a threshold value aligned along a predetermined direction is detected on the polishing subject face based upon the three-dimensional shape data, the polishing tool to move along a virtual line interconnecting the plurality of protruding portions.