US 11,717,936 B2
Methods for a web-based CMP system
Dmitry Sklyar, San Jose, CA (US); Jeonghoon Oh, Saratoga, CA (US); Gerald J. Alonzo, Los Gatos, CA (US); Jonathan Domin, Sunnyvale, CA (US); Steven M. Zuniga, Soquel, CA (US); and Jay Gurusamy, Santa Clara, CA (US)
Assigned to Applied Materials, Inc., Santa Clara, CA (US)
Filed by Applied Materials, Inc., Santa Clara, CA (US)
Filed on Aug. 27, 2019, as Appl. No. 16/552,901.
Claims priority of provisional application 62/731,362, filed on Sep. 14, 2018.
Prior Publication US 2020/0086456 A1, Mar. 19, 2020
Int. Cl. B24B 49/04 (2006.01); H01L 21/321 (2006.01); H01L 21/67 (2006.01); B24B 37/005 (2012.01); B24B 57/04 (2006.01)
CPC B24B 49/04 (2013.01) [B24B 37/005 (2013.01); B24B 57/04 (2013.01); H01L 21/3212 (2013.01); H01L 21/67092 (2013.01)] 16 Claims
OG exemplary drawing
 
1. A substrate processing method, comprising:
winding a used portion of a polishing article onto a take-up roll of a polishing system by rotating a first spindle having the take-up roll disposed thereon, the polishing system having a platform body having a platen disposed in a surface thereof, and a plurality of web guides fixedly attached to opposite ends of the platform body, wherein each of the web guides have a respective opening formed therethrough;
measuring, using an encoder wheel, a polishing article advancement length of the used portion of the polishing article wound onto the take-up roll;
determining a tensioning torque to apply to a supply roll using the polishing article advancement length measurement; and
tensioning the polishing article by applying the tensioning torque to the supply roll around which a first portion of the polishing article is wound.