CPC B24B 49/04 (2013.01) [B24B 37/005 (2013.01); B24B 57/04 (2013.01); H01L 21/3212 (2013.01); H01L 21/67092 (2013.01)] | 16 Claims |
1. A substrate processing method, comprising:
winding a used portion of a polishing article onto a take-up roll of a polishing system by rotating a first spindle having the take-up roll disposed thereon, the polishing system having a platform body having a platen disposed in a surface thereof, and a plurality of web guides fixedly attached to opposite ends of the platform body, wherein each of the web guides have a respective opening formed therethrough;
measuring, using an encoder wheel, a polishing article advancement length of the used portion of the polishing article wound onto the take-up roll;
determining a tensioning torque to apply to a supply roll using the polishing article advancement length measurement; and
tensioning the polishing article by applying the tensioning torque to the supply roll around which a first portion of the polishing article is wound.
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