CPC B23K 26/382 (2015.10) [B23K 26/0661 (2013.01); B23K 26/083 (2013.01); B23K 26/123 (2013.01)] | 2 Claims |
1. A laser processing apparatus that Rains a plurality of through-holes by irradiating a workpiece having an arch-shaped longitudinal section protruding upward and extending in an annular shape with a laser beam from above, the laser processing apparatus comprising:
a workpiece support portion which supports a lower surface side of the workpiece and forms a closed space between the supported workpiece and the workpiece support portion;
a plurality of pads which are movable upward and downward inside the closed space and comprise upper surfaces respectively coming into contact with a plurality of regions, obtained by dividing a processing object region having the through-holes formed in the workpiece, to surround the region of the workpiece over one circle when the pads move upward;
a drive unit which drives each of the plurality of pads to move forward and backward between a state in which the pad is in contact with the workpiece and a state in which the pad is separated from the workpiece;
a gas supply unit which supplies a gas into the closed space; and
a clamp which comes into contact with the workpiece supported by the workpiece support portion on an inner circumferential surface or an outer circumferential surface from above over one circle,
wherein a portion comprising the contact surface of the pad is formed of a flexible sealing member.
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