US 11,717,912 B2
Capillary guide device and wire bonding apparatus
Yohei Uchida, Tokyo (JP)
Assigned to SHINKAWA LTD., Tokyo (JP)
Appl. No. 17/431,718
Filed by SHINKAWA LTD., Tokyo (JP)
PCT Filed Mar. 16, 2020, PCT No. PCT/JP2020/011535
§ 371(c)(1), (2) Date Aug. 18, 2021,
PCT Pub. No. WO2020/189642, PCT Pub. Date Sep. 24, 2020.
Claims priority of application No. 2019-049856 (JP), filed on Mar. 18, 2019.
Prior Publication US 2022/0134468 A1, May 5, 2022
Int. Cl. B23K 20/00 (2006.01); B23K 20/10 (2006.01); B23K 20/26 (2006.01); H01L 23/00 (2006.01); B23K 101/40 (2006.01); B23K 101/42 (2006.01)
CPC B23K 20/005 (2013.01) [B23K 20/10 (2013.01); B23K 20/26 (2013.01); H01L 24/78 (2013.01); B23K 2101/40 (2018.08); B23K 2101/42 (2018.08); H01L 2224/789 (2013.01); H01L 2224/78301 (2013.01); H01L 2224/78349 (2013.01)] 5 Claims
OG exemplary drawing
 
1. A capillary guide device, adapted to guide a capillary into a holding hole of a bonding tool, comprising:
a guide body portion, capable of being in contact with the capillary held in the holding hole; and
a drive portion, arranging the guide body portion at a position capable of being in contact with the capillary by moving the guide body portion along a second direction, wherein the second direction is a direction intersecting a first direction along a central axis of the holding hole, wherein
the drive portion comprises:
a moving body, connected to the guide body portion;
a drive shaft, extending in the second direction and exerting a frictional resistance force with the moving body; and
an ultrasonic wave generation body, fixed to an end of the drive shaft and supplying an ultrasonic wave to the drive shaft.