US 11,717,892 B1
Additively featured plates for heat exchangers
Matthew David Carlson, Eau Claire, WI (US); Yasmin Dennig, Albuquerque, NM (US); Judith Maria Lavin, Albuquerque, NM (US); David M. Keicher, Albuquerque, NM (US); and Carl Schalansky, Sacramento, CA (US)
Assigned to National Technology & Engineering Solutions of Sandia, LLC, Albuquerque, NM (US); and Vacuum Process Engineering, Inc., Sacramento, CA (US)
Filed by National Technology & Engineering Solutions of Sandia, LLC, Albuquerque, NM (US); and Vacuum Process Engineering, Inc., Sacramento, CA (US)
Filed on Aug. 31, 2021, as Appl. No. 17/462,072.
Int. Cl. B22F 10/28 (2021.01); B33Y 10/00 (2015.01); F28D 1/053 (2006.01)
CPC B22F 10/28 (2021.01) [B33Y 10/00 (2014.12); F28D 1/05383 (2013.01); F28F 2260/02 (2013.01)] 16 Claims
OG exemplary drawing
 
1. A process for forming a microchannel heat exchanger core, the process comprising the steps of:
providing one or more plate substrates;
printing microchannel walls on the one or more plate substrates using an additive manufacturing (AM) process, thereby producing one or more AM featured plates;
bonding the one or more AM featured plates together to form the microchannel heat exchanger core, the bonding step adapted to simultaneously join the AM featured plates and densify the microchannel walls; and
forming hot and cold inlet and outlet headers adjacent to the microchannel walls.