US 11,717,271 B2
Thermally-conductive material layer and internal structure for ultrasound imaging
Junho Song, N. Andover, MA (US); Edward Chan, Brookline, MA (US); Steven Michael Tavoletti, Reading, MA (US); and Mehdi Hejazi Dehaghani, Salem, MA (US)
Assigned to KONINKLIJKE PHILIPS N.V., Eindhoven (NL)
Appl. No. 17/43,692
Filed by KONINKLIJKE PHILIPS N.V., Eindhoven (NL)
PCT Filed Mar. 22, 2019, PCT No. PCT/EP2019/057249
§ 371(c)(1), (2) Date Sep. 30, 2020,
PCT Pub. No. WO2019/185478, PCT Pub. Date Oct. 3, 2019.
Claims priority of provisional application 62/650,799, filed on Mar. 30, 2018.
Prior Publication US 2021/0059645 A1, Mar. 4, 2021
Int. Cl. A61B 8/00 (2006.01)
CPC A61B 8/546 (2013.01) [A61B 8/4236 (2013.01); A61B 8/4254 (2013.01); A61B 8/4455 (2013.01); A61B 8/4494 (2013.01)] 15 Claims
OG exemplary drawing
 
1. An ultrasound imaging probe, comprising:
a housing configured for handheld use;
a support structure different from the housing and disposed within the housing, the support structure comprising:
a thermally-conductive material;
a coupling surface disposed at a distal portion of the support structure; and
an outer surface different from the coupling surface;
a continuous thermally-conductive layer different from the thermally conductive material and coupled to the outer surface and the coupling surface of the support structure, the continuous thermally-conductive layer thereby providing a heat transmission path between the coupling surface and the outer surface; and
an ultrasound sensor coupled to the support structure at the coupling surface and directly in contact with the continuous thermally-conductive layer at the coupling surface, such that heat from the ultrasound sensor is transmitted away to the support structure via the heat transmission path of the continuous thermally-conductive layer.