US 11,716,829 B1
Integrated fan and heat sink for head-mountable device
Cheng P. Tan, Fremont, CA (US); Sivesh Selvakumar, Sunnyvale, CA (US); Jesse T. Dybenko, Santa Cruz, CA (US); Enoch Mylabathula, Cupertino, CA (US); Jason C. Sauers, Sunnyvale, CA (US); Phil M. Hobson, Menlo Park, CA (US); Laura M. Campo, Santa Clara, CA (US); and Dragos Moroianu, Cupertino, CA (US)
Assigned to Apple Inc., Cupertino, CA (US)
Filed by Apple Inc., Cupertino, CA (US)
Filed on Feb. 2, 2021, as Appl. No. 17/165,763.
Claims priority of provisional application 62/990,978, filed on Mar. 17, 2020.
Int. Cl. H05K 7/20 (2006.01)
CPC H05K 7/20136 (2013.01) [H05K 7/2039 (2013.01)] 19 Claims
OG exemplary drawing
 
9. A head-mountable device comprising:
a circuit component; and
a cooling module comprising:
a cover;
a planar back plate coupled to the cover at a first end of the cover, the planar back plate being thermally connected to the circuit component;
a fan between the cover and the planar back plate; and
fins being positioned extending from the planar back plate to the cover, the fins being coupled to the cover on a second end of the cover, opposite the first end, the planar back plate and the fins forming a continuous piece of material extending from the first end of the cover to the second end of the cover, wherein the second end of the cover forms an exhaust duct extending from the fins to the planar back plate to surround an outlet.