US 11,715,889 B2
Slow wave structure for millimeter wave antennas
Zhichao Zhang, Chandler, AZ (US); Jiwei Sun, Chandler, AZ (US); and Kemal Aygun, Tempe, AZ (US)
Assigned to Intel Corporation, Santa Clara, CA (US)
Filed by Intel Corporation, Santa Clara, CA (US)
Filed on Aug. 16, 2021, as Appl. No. 17/402,916.
Application 17/402,916 is a continuation of application No. 16/493,520, granted, now 11,095,045, previously published as PCT/US2017/025072, filed on Mar. 30, 2017.
Prior Publication US 2022/0037803 A1, Feb. 3, 2022
This patent is subject to a terminal disclaimer.
Int. Cl. H01Q 21/24 (2006.01); H05K 1/02 (2006.01); H01P 9/00 (2006.01)
CPC H01Q 21/24 (2013.01) [H05K 1/0243 (2013.01); H05K 1/0248 (2013.01); H01P 9/00 (2013.01); H05K 2201/10098 (2013.01)] 30 Claims
OG exemplary drawing
 
1. A printed circuit board comprising:
a first layer and a second layer substantially parallel to and spaced apart from the first layer;
an integrated circuit connected to the first layer and configured to provide a first electronic signal over a first conductive path between a first pair of conductive points and a second electronic signal over a second conductive path between a second pair of conductive points;
wherein the first conductive path includes a first narrow section extending between a first broad section and a second broad section, wherein:
the first narrow section has a first dimension; and
the first broad section and the second broad section have a second dimension, the second dimension greater than the first dimension; and
wherein the second conductive path includes a finger extending toward the narrow section of the first conductive path and having a third dimension, the third dimension greater than the second dimension.