US 11,715,878 B2
Three-dimensional electronic component and electronic device
Zhi-Hua Feng, Taipei (TW); Chia-Ho Lin, Taipei (TW); Pin-Tang Chiu, Taipei (TW); and Zhen-De Jiang, Taipei (TW)
Assigned to ASUSTEK COMPUTER INC., Taipei (TW)
Filed by ASUSTeK COMPUTER INC., Taipei (TW)
Filed on Sep. 16, 2021, as Appl. No. 17/476,544.
Claims priority of application No. 109134311 (TW), filed on Sep. 30, 2020.
Prior Publication US 2022/0102862 A1, Mar. 31, 2022
Int. Cl. H01Q 9/04 (2006.01); H01Q 1/48 (2006.01); H01Q 5/357 (2015.01)
CPC H01Q 9/0457 (2013.01) [H01Q 1/48 (2013.01); H01Q 5/357 (2015.01); H01Q 9/0471 (2013.01)] 21 Claims
OG exemplary drawing
 
1. A three-dimensional electronic component, comprising:
at least four surfaces, comprising a first surface, a second surface, a third surface, and a fourth surface, wherein the first surface is adjacent to the second surface and the third surface, and the fourth surface is adjacent to the second surface and the third surface and is opposite to the first surface; and
an antenna structure, located on the four surfaces and comprising:
a first radiating metal portion, located on the first surface and extending to the second surface;
a second radiating metal portion, located on the first surface and extending to the third surface, wherein there is a gap between the first radiating metal portion and the second radiating metal portion that are located on the first surface;
at least one adjusting metal branch, located on the first surface and connected to the first radiating metal portion;
a feed point, disposed on the first radiating metal portion and close to the gap;
a ground point, disposed on the second radiating metal portion and close to the gap;
a first ground connection portion, connected to the first radiating metal portion, located on the fourth surface, and grounded; and
a second ground connection portion, connected to the second radiating metal portion, located on the fourth surface, and grounded.