CPC H01M 50/24 (2021.01) [H01M 50/186 (2021.01); H01M 50/242 (2021.01); B63C 11/52 (2013.01)] | 13 Claims |
1. A circuit board assembly enclosure for providing a predetermined pressure distribution, the circuit board assembly enclosure comprising:
a circuit board assembly comprising a circuit board having a first surface and a second surface, the circuit board assembly comprising one or more circuit components mounted on the first surface; and
a first pressure distribution structure positioned over the circuit board assembly, wherein the first pressure distribution structure comprises:
one or more areas conforming to and in contact with one or more corresponding sections of the first surface, and
one or more cavities, each cavity configured to receive one of the one or more circuit components, the one or more cavities comprising a first cavity having a first volume larger than a volume of a corresponding first circuit component of the one or more circuit components so as to create a first gap between the first pressure distribution structure and the first circuit component when the enclosure is at sea level,
wherein the circuit board assembly enclosure is configured to withstand pressures of at least 7,000 psi.
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