CPC H01L 25/167 (2013.01) [H01L 21/02118 (2013.01); H01L 21/3212 (2013.01); H01L 24/08 (2013.01); H01L 24/80 (2013.01); H01L 25/105 (2013.01); H01L 25/18 (2013.01); H01L 27/1214 (2013.01); H01L 27/156 (2013.01); H01L 33/007 (2013.01); H01L 33/0093 (2020.05); H01L 33/06 (2013.01); H01L 33/32 (2013.01); H01L 33/44 (2013.01); H01L 33/46 (2013.01); H01L 33/62 (2013.01); H01L 2224/08145 (2013.01); H01L 2224/80013 (2013.01); H01L 2224/80355 (2013.01); H01L 2224/80357 (2013.01); H01L 2933/0016 (2013.01); H01L 2933/0025 (2013.01); H01L 2933/0066 (2013.01)] | 19 Claims |
1. An apparatus comprising:
a substrate;
a light emitting diode (LED) array comprising a plurality of LED elements, wherein the LED array is located on a first side of the substrate;
one or more first optical elements integrated on a second side of the substrate, wherein the one or more first optical elements are configured to transmit optical signals from the plurality of LED elements, and wherein the second side is opposite the first side; and
a complementary metal-oxide-semiconductor (CMOS) based device direct bonded to the LED array.
|