US 11,715,716 B2
Electronic device, package structure and electronic manufacturing method
Pei-Jen Lo, Kaohsiung (TW)
Assigned to ADVANCED SEMICONDUCTOR ENGINEERING, INC., Kaohsiung (TW)
Filed by Advanced Semiconductor Engineering, Inc., Kaohsiung (TW)
Filed on Jul. 16, 2021, as Appl. No. 17/378,513.
Prior Publication US 2023/0018031 A1, Jan. 19, 2023
Int. Cl. H01L 23/498 (2006.01); H01L 25/18 (2023.01); H01L 23/00 (2006.01)
CPC H01L 24/13 (2013.01) [H01L 23/49811 (2013.01); H01L 23/49822 (2013.01); H01L 24/14 (2013.01); H01L 24/16 (2013.01); H01L 24/81 (2013.01); H01L 25/18 (2013.01); H01L 2224/13019 (2013.01); H01L 2224/1403 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/81345 (2013.01); H01L 2224/81815 (2013.01)] 16 Claims
OG exemplary drawing
 
1. An electronic device, comprising:
a substrate;
a first bump disposed over the substrate, and having a first width, wherein an end portion of the first bump defines a first recess portion;
a second bump disposed over the substrate, and having a second width less than the first width; and
a first reflowable material disposed on the first bump and extending in the first recess portion,
wherein an elevation of a bottom of the first recess portion is different from an elevation of a bottom of a second recess portion.