| CPC H01L 24/09 (2013.01) [H01L 21/56 (2013.01); H01L 23/3107 (2013.01); H01L 23/5283 (2013.01); H01L 2224/02371 (2013.01)] | 20 Claims |
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1. A method for making a semiconductor device, comprising:
providing a substrate comprising:
a substrate first surface;
a substrate second surface opposite to the substrate first surface; and
electronic devices formed as part of the substrate and separated by spaces, wherein each electronic device has pads formed over the substrate first surface;
attaching leadframe interconnects to the pads, wherein each leadframe interconnect spans the spaces between neighboring electronic devices, and wherein each leadframe interconnect comprises:
first regions coupled to respective pads of respective neighboring electronic devices and extending in a first direction, and
a second region structure coupling the first regions to each other in a second direction that is different than the first direction;
providing an encapsulant on the substrate first surface so that the encapsulant is between each of the leadframe interconnects and is between each of the leadframe interconnects and the substrate first surface; and
singulating the substrate and the leadframe interconnects to separate each second region structure into second regions and the substrate into individual electronic devices.
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