US 11,715,694 B2
Embedded component package structure having a magnetically permeable layer
Hsing Kuo Tien, Kaohsiung (TW); and Chih Cheng Lee, Kaohsiung (TW)
Assigned to ADVANCED SEMICONDUCTOR ENGINEERING, INC., Kaohsiung (TW)
Filed by Advanced Semiconductor Engineering, Inc., Kaohsiung (TW)
Filed on Jul. 12, 2021, as Appl. No. 17/373,532.
Application 17/373,532 is a continuation of application No. 16/528,336, filed on Jul. 31, 2019, granted, now 11,062,996.
Prior Publication US 2021/0343648 A1, Nov. 4, 2021
This patent is subject to a terminal disclaimer.
Int. Cl. H01L 23/538 (2006.01); H01L 21/48 (2006.01); H01L 23/31 (2006.01)
CPC H01L 23/5383 (2013.01) [H01L 21/486 (2013.01); H01L 21/4857 (2013.01); H01L 23/3128 (2013.01); H01L 23/5384 (2013.01)] 12 Claims
OG exemplary drawing
 
1. An embedded component package structure, comprising:
a magnetically permeable layer having a top surface;
a first conductive element in the magnetically permeable layer, wherein the first conductive element has a first substantially planar surface exposed from the magnetically permeable layer;
a conductive layer disposed on the top surface of the magnetically permeable layer and electrically connected with the first conductive element; and
a dielectric layer disposed between the conductive layer and the magnetically permeable layer, wherein the dielectric layer is in contact with a part of the first substantially planar surface of the first conductive element.