US 11,715,691 B2
Integrated circuit package with integrated voltage regulator
Milind S. Bhagavat, Broomfield, CO (US); Rahul Agarwal, Santa Clara, CA (US); and Chia-Hao Cheng, Hsinchu (TW)
Assigned to ADVANCED MICRO DEVICES, INC., Santa Clara, CA (US)
Filed by ADVANCED MICRO DEVICES, INC., Santa Clara, CA (US)
Filed on May 18, 2021, as Appl. No. 17/323,454.
Application 17/323,454 is a division of application No. 16/367,731, filed on Mar. 28, 2019, granted, now 11,011,466.
Prior Publication US 2021/0313269 A1, Oct. 7, 2021
Int. Cl. H01L 23/52 (2006.01); H01L 23/528 (2006.01); H01L 23/31 (2006.01); H01L 23/522 (2006.01); H01L 23/00 (2006.01); H01L 21/56 (2006.01); H01L 25/065 (2023.01)
CPC H01L 23/5283 (2013.01) [H01L 21/566 (2013.01); H01L 23/3128 (2013.01); H01L 23/5227 (2013.01); H01L 24/09 (2013.01); H01L 24/17 (2013.01); H01L 25/0655 (2013.01); H01L 2224/0231 (2013.01); H01L 2224/02373 (2013.01); H01L 2224/02379 (2013.01); H01L 2224/02381 (2013.01); H01L 2224/0401 (2013.01); H01L 2924/1206 (2013.01); H01L 2924/1427 (2013.01)] 15 Claims
OG exemplary drawing
 
1. A semiconductor chip device, comprising:
a first redistribution layer (RDL) structure having a first plurality of conductor traces;
a first molding layer on the first RDL structure;
plural conductive pillars in the first molding layer, each of the conductive pillars including a first end and a second end;
a second RDL structure on the first molding layer, the second RDL structure having a second plurality of conductor traces;
wherein some of the conductive pillars are electrically connected between some of the first plurality of conductor traces and some of the second plurality of conductor traces to provide a first inductor coil; and
a first semiconductor chip mounted on the second RDL structure, the first semiconductor chip having voltage regulator switching and control logic connected to the first inductor coil to provide an integrated voltage regulator.