US 11,715,676 B2
Semiconductor device
Kenji Nishikawa, Sagamihara (JP)
Assigned to Amkor Technology Singapore Holding Pte. Ltd., Singapore (SG)
Filed by Amkor Technology Singapore Holding Pte. Ltd., Valley Point (SG)
Filed on Jan. 22, 2021, as Appl. No. 17/155,248.
Application 17/155,248 is a continuation of application No. 16/431,691, filed on Jun. 4, 2019, granted, now 10,910,294.
Prior Publication US 2021/0143087 A1, May 13, 2021
Int. Cl. H01L 23/00 (2006.01); H01L 23/495 (2006.01); H01L 23/31 (2006.01); H01L 21/48 (2006.01); H01L 21/56 (2006.01)
CPC H01L 23/49524 (2013.01) [H01L 21/4825 (2013.01); H01L 21/565 (2013.01); H01L 23/3114 (2013.01); H01L 23/4952 (2013.01); H01L 23/49513 (2013.01); H01L 23/49562 (2013.01); H01L 24/37 (2013.01); H01L 24/40 (2013.01); H01L 24/84 (2013.01); H01L 2224/37011 (2013.01); H01L 2224/40245 (2013.01); H01L 2224/84815 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A semiconductor device, comprising:
a substrate comprising:
a lead;
a semiconductor component comprising:
a component top side; and
a component bottom side opposite to the component top side; and
a conductive clip coupled to the semiconductor component and the substrate, wherein the conductive clip comprises:
a plate portion attached to the component top side with a conductive material; and
a clip connecting portion coupled to the plate portion and coupled to the lead, wherein:
the plate portion comprises through-holes extending from an upper side of the plate portion to a lower side of the plate portion;
the plate portion further comprises stand-offs extending from the lower side of the plate portion towards the component top side;
the lower side of the plate portion comprises a first profile in a first cross-sectional view;
the upper side of the plate portion comprises a second profile in the first cross-sectional view; and
the stand-offs comprise a first standoff proximate to a first corner of the plate portion and a second stand-off proximate to second corner of the plate portion.