CPC H01L 23/49524 (2013.01) [H01L 21/4825 (2013.01); H01L 21/565 (2013.01); H01L 23/3114 (2013.01); H01L 23/4952 (2013.01); H01L 23/49513 (2013.01); H01L 23/49562 (2013.01); H01L 24/37 (2013.01); H01L 24/40 (2013.01); H01L 24/84 (2013.01); H01L 2224/37011 (2013.01); H01L 2224/40245 (2013.01); H01L 2224/84815 (2013.01)] | 20 Claims |
1. A semiconductor device, comprising:
a substrate comprising:
a lead;
a semiconductor component comprising:
a component top side; and
a component bottom side opposite to the component top side; and
a conductive clip coupled to the semiconductor component and the substrate, wherein the conductive clip comprises:
a plate portion attached to the component top side with a conductive material; and
a clip connecting portion coupled to the plate portion and coupled to the lead, wherein:
the plate portion comprises through-holes extending from an upper side of the plate portion to a lower side of the plate portion;
the plate portion further comprises stand-offs extending from the lower side of the plate portion towards the component top side;
the lower side of the plate portion comprises a first profile in a first cross-sectional view;
the upper side of the plate portion comprises a second profile in the first cross-sectional view; and
the stand-offs comprise a first standoff proximate to a first corner of the plate portion and a second stand-off proximate to second corner of the plate portion.
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