US 11,715,671 B2
Film forming system, magnetization characteristic measuring device, and film forming method
Hiroaki Chihaya, Nirasaki (JP); Einstein Noel Abarra, Tokyo (JP); and Shota Ishibashi, Nirasaki (JP)
Assigned to TOKYO ELECTRON LIMITED, Tokyo (JP)
Filed by TOKYO ELECTRON LIMITED, Tokyo (JP)
Filed on Sep. 15, 2020, as Appl. No. 17/21,846.
Claims priority of application No. 2019-169296 (JP), filed on Sep. 18, 2019.
Prior Publication US 2021/0082777 A1, Mar. 18, 2021
Int. Cl. H01L 21/66 (2006.01); G01R 33/032 (2006.01); G01N 27/72 (2006.01); C23C 14/56 (2006.01); H10N 50/01 (2023.01)
CPC H01L 22/14 (2013.01) [C23C 14/566 (2013.01); G01N 27/72 (2013.01); G01R 33/032 (2013.01); H10N 50/01 (2023.02)] 20 Claims
OG exemplary drawing
 
1. A film forming system for forming a magnetic film, comprising:
a processing module configured to form the magnetic film on a substrate;
a magnetization characteristic measuring device configured to measure magnetization characteristics of the magnetic film formed on the substrate in the processing module; and
a transfer unit configured to transfer the substrate between the processing module and the magnetization characteristic measuring device,
wherein the magnetization characteristic measuring device includes a magnetic field applying mechanism having a permanent magnet magnetic circuit configured to apply a magnetic field to the substrate and adjust the magnetic field to be applied to the substrate, and a detector configured to detect magnetization characteristics of the substrate.