US 11,714,941 B2
Modular periphery tile for integrated circuit device
Chee Hak Teh, Bayan Lepas (MY); Ankireddy Nalamalpu, Portland, OR (US); Md Altaf Hossain, Portland, OR (US); Dheeraj Subbareddy, Portland, OR (US); Sean R. Atsatt, Santa Cruz, CA (US); and Lai Guan Tang, Tanjung Bungah (MY)
Assigned to Intel Corporation, Santa Clara, CA (US)
Filed by Intel Corporation, Santa Clara, CA (US)
Filed on Aug. 2, 2021, as Appl. No. 17/392,218.
Application 16/833,122 is a division of application No. 16/235,933, filed on Dec. 28, 2018, granted, now 10,642,946, issued on May 5, 2020.
Application 17/392,218 is a continuation of application No. 16/833,122, filed on Mar. 27, 2020, granted, now 11,080,449.
Prior Publication US 2022/0198115 A1, Jun. 23, 2022
Int. Cl. G06F 30/34 (2020.01); H03K 19/17736 (2020.01); H04L 12/43 (2006.01); G06F 15/78 (2006.01); H03K 19/17796 (2020.01)
CPC G06F 30/34 (2020.01) [G06F 15/7825 (2013.01); H03K 19/17744 (2013.01); H03K 19/17796 (2013.01); H04L 12/43 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A multi-die package, comprising:
a package substrate;
a plurality of first dies mounted on the package substrate and comprising a first plurality of routers to facilitate off-package communication, wherein respective dies of the plurality of first dies perform processing; and
an input/output (I/O) die physically separate from the plurality of first dies, wherein the I/O die is mounted on the package substrate and configurable to support external memory interfaces comprising a second plurality of routers to facilitate off-package communication with the plurality of first dies by interfacing with the first plurality of routers, wherein the I/O die facilitates off-package communication between the plurality of first dies and one or more off-package devices via the package substrate.