CPC G06F 30/34 (2020.01) [G06F 15/7825 (2013.01); H03K 19/17744 (2013.01); H03K 19/17796 (2013.01); H04L 12/43 (2013.01)] | 20 Claims |
1. A multi-die package, comprising:
a package substrate;
a plurality of first dies mounted on the package substrate and comprising a first plurality of routers to facilitate off-package communication, wherein respective dies of the plurality of first dies perform processing; and
an input/output (I/O) die physically separate from the plurality of first dies, wherein the I/O die is mounted on the package substrate and configurable to support external memory interfaces comprising a second plurality of routers to facilitate off-package communication with the plurality of first dies by interfacing with the first plurality of routers, wherein the I/O die facilitates off-package communication between the plurality of first dies and one or more off-package devices via the package substrate.
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