CPC C23C 16/4485 (2013.01) [C23C 14/14 (2013.01); C23C 14/246 (2013.01); C23C 14/543 (2013.01); C23C 16/06 (2013.01); C23C 16/4557 (2013.01); C23C 16/45519 (2013.01); C23C 16/45561 (2013.01); C23C 16/45565 (2013.01); C23C 16/52 (2013.01); H01M 4/381 (2013.01)] | 13 Claims |
1. A depositing arrangement for evaporation of a material comprising an alkali metal or alkaline earth metal and for deposition of the material on a substrate disposed in a physical vapor deposition chamber, comprising:
a first chamber configured to liquefy the material, the first chamber having a non-reactive atmosphere, the non-reactive atmosphere preventing a reaction with the material;
a valve being in fluid communication with the first chamber, and being downstream of the first chamber, wherein the valve is configured to control of the flow rate of the liquefied material through the valve and wherein the valve is configured to further provide the liquefied material;
an evaporation zone being in fluid communication with the valve, and being downstream of the valve, wherein the evaporation zone comprises a surface disposed within a plenum defined by inner walls of a vapor distribution showerhead, the surface being heated by a first heating unit disposed in the plenum and configured to provide thermal energy to the material at a temperature suitable for evaporating the material;
a second heating unit to heat the material to higher temperatures before providing the material in the evaporation zone; and
the vapor distribution showerhead comprising one or more outlets to direct the vaporized material towards the substrate.
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