US 11,712,887 B2
Dies including strain gauge sensors and temperature sensors
James M. Gardner, Corvallis, OR (US); Berkeley Fisher, Corvallis, OR (US); and Daryl E Anderson, Corvallis, OR (US)
Assigned to Hewlett-Packard Development Company L.P., Spring, TX (US)
Filed by HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P., Spring, TX (US)
Filed on Nov. 25, 2020, as Appl. No. 17/105,195.
Application 17/105,195 is a continuation of application No. 16/619,172, granted, now 10,870,273, previously published as PCT/US2017/042586, filed on Jul. 18, 2017.
Prior Publication US 2021/0078320 A1, Mar. 18, 2021
This patent is subject to a terminal disclaimer.
Int. Cl. B41J 2/045 (2006.01); B41J 2/14 (2006.01); B41J 29/393 (2006.01); G01L 1/18 (2006.01); G01L 1/22 (2006.01)
CPC B41J 2/04563 (2013.01) [B41J 2/04508 (2013.01); B41J 2/04586 (2013.01); B41J 2/14153 (2013.01); B41J 29/393 (2013.01); G01L 1/18 (2013.01); G01L 1/22 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A die comprising:
a plurality of fluid pumps;
at least one strain gauge sensor to sense a strain in the die; and
at least one temperature sensor to sense the temperature of the die to compensate for a temperature component of the sensed strain.