US 10,368,448 B2
Method of manufacturing a component carrier
Marco Gavagnin, Leoben (AT); Gernot Grober, Graz (AT); and Christian Vockenberger, Leoben (AT)
Assigned to AT&S Austria Technologie & Systemtechnik Aktiengesellschaft, Leoben (AT)
Filed by AT & S Austria Technologie & Systemtechnik Aktiengesellschaft, Leoben (AT)
Filed on Nov. 27, 2017, as Appl. No. 15/822,427.
Claims priority of application No. 17201226 (EP), filed on Nov. 11, 2017.
Prior Publication US 2019/0150295 A1, May 16, 2019
Int. Cl. H05K 3/32 (2006.01); H05K 1/18 (2006.01)
CPC H05K 3/32 (2013.01) [H05K 1/18 (2013.01)] 16 Claims
OG exemplary drawing
 
1. A method of manufacturing a component carrier, comprising:
electrically testing a first component carrier block, a second component carrier block and a component for compliance with at least one quality criterion; and
classifying the first component carrier block, the second component carrier block, and the component as a known-good first component carrier block, a known-good second component carrier block, and a known-good component, respectively, only if the tested first component carrier block, second component carrier block, and component, respectively, meet the at least one quality criterion;
arranging the known-good component on or spaced with regard to the first known-good component carrier block;
thereafter forming an electrically conductive connection structure on, in, or spaced from the first known-good component carrier block;
embedding the known-good component within at least one of the first known-good component carrier block and the second known-good component carrier block for forming a component carrier.