US 10,368,446 B2
Method for producing a printed circuit board
J.A.A.M. Tourne, Helmond (NL)
Assigned to Nextgin Technology BV, Helmond (NL)
Filed by NextGin Technology BV, Helmond (NL)
Filed on Mar. 16, 2017, as Appl. No. 15/461,114.
Application 15/461,114 is a continuation of application No. 15/048,510, filed on Feb. 19, 2016, granted, now 9,603,255.
Claims priority of provisional application 62/118,740, filed on Feb. 20, 2015.
Prior Publication US 2017/0188466 A1, Jun. 29, 2017
This patent is subject to a terminal disclaimer.
Int. Cl. H05K 3/02 (2006.01); H05K 3/10 (2006.01); H05K 1/02 (2006.01); H05K 3/40 (2006.01); H05K 1/11 (2006.01); H05K 3/42 (2006.01); H05K 3/46 (2006.01); H05K 3/00 (2006.01)
CPC H05K 3/107 (2013.01) [H05K 1/0251 (2013.01); H05K 1/115 (2013.01); H05K 3/403 (2013.01); H05K 3/42 (2013.01); H05K 3/4644 (2013.01); H05K 1/0245 (2013.01); H05K 1/0298 (2013.01); H05K 3/0044 (2013.01); H05K 2201/09036 (2013.01); H05K 2201/0959 (2013.01); H05K 2201/09645 (2013.01); H05K 2201/09854 (2013.01); H05K 2203/0228 (2013.01); Y10T 29/49165 (2015.01)] 25 Claims
OG exemplary drawing
 
1. A method for producing a printed circuit board, comprising the steps of:
forming a slot in a substrate having at least three layers of interleaved conductive paths and insulators with the slot extending through at least two of the layers, the slot having a length and a width with the length being greater than the width, the slot having a first end and a second end, the first end and the second end having a semi-circular shape, the slot being formed by laterally translating a router bit;
coating a sidewall of the substrate surrounding the slot with a conductive layer; and
separating the conductive layer into at least two segments that are electrically isolated along the side wall of the substrate.