US 10,368,445 B2
Multilayer rigid flexible printed circuit board and method for manufacturing the same
Yang Je Lee, Suwon-si (KR); Dek Gin Yang, Suwon-si (KR); Dong Gi An, Suwon-si (KR); and Jae Ho Shin, Suwon-si (KR)
Assigned to Samsung Electro-Mechanics Co., Ltd., Suwon-si (KR)
Filed by SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si (KR)
Filed on Jan. 5, 2017, as Appl. No. 15/398,803.
Application 15/398,803 is a continuation of application No. 14/024,115, filed on Sep. 11, 2013, granted, now 9,743,529.
Application 14/024,115 is a continuation of application No. 12/923,994, filed on Oct. 19, 2010, granted, now 8,558,116, issued on Oct. 15, 2013.
Claims priority of application No. 10-2009-0102783 (KR), filed on Oct. 28, 2009.
Prior Publication US 2017/0118833 A1, Apr. 27, 2017
Int. Cl. H05K 1/02 (2006.01); H05K 3/06 (2006.01); H05K 3/46 (2006.01); H05K 1/09 (2006.01); H05K 3/38 (2006.01); H05K 3/00 (2006.01); H05K 3/28 (2006.01)
CPC H05K 3/06 (2013.01) [H05K 1/028 (2013.01); H05K 1/0218 (2013.01); H05K 1/0278 (2013.01); H05K 1/09 (2013.01); H05K 3/386 (2013.01); H05K 3/4644 (2013.01); H05K 3/4691 (2013.01); H05K 3/0035 (2013.01); H05K 3/281 (2013.01); H05K 3/4652 (2013.01); H05K 2201/0154 (2013.01); H05K 2201/0187 (2013.01); H05K 2201/0707 (2013.01); H05K 2203/0554 (2013.01); H05K 2203/1152 (2013.01); Y10T 29/49128 (2015.01); Y10T 29/49165 (2015.01)] 11 Claims
OG exemplary drawing
 
1. A multilayer rigid flexible printed circuit board comprising:
a flexible film comprising a first circuit pattern on one or both surfaces, and having an area corresponding to a rigid region and a flexible region of the multilayer rigid flexible printed circuit board, the first circuit pattern comprising a first portion in the flexible region and a second portion in the rigid region;
a first insulating layer disposed on the flexible film in the flexible region to cover the first portion of the first circuit pattern and having an extension portion extending into the flexible film in the rigid region;
a copper pattern positioned at the rigid region of the flexible film and disposed on the extension portion of the first insulating layer; and
a second insulating layer disposed on and in contact with the flexible film in the rigid region, covering the copper pattern, and comprising a second circuit pattern,
wherein the copper pattern is physically isolated from the first circuit pattern and the second circuit pattern.