US 10,368,436 B2
Conductor pad for flexible circuits and flexible circuit incorporating the same
Sridharan Venk, Treviso (IT); Earl Alfred Picard, Jr., Portsmouth, NH (US); Qi Dai, Shanghai (CN); and Richard Garner, Arlington, MA (US)
Assigned to OSRAM SYLVANIA Inc., Wilmington, MA (US)
Filed by Sridharan Venk, Treviso (IT); Earl Alfred Picard, Jr., Portsmouth, NH (US); Qi Dai, Shanghai (CN); and Richard Garner, Arlington, MA (US)
Filed on Mar. 15, 2017, as Appl. No. 15/459,740.
Application 15/459,740 is a continuation of application No. 14/292,829, filed on May 31, 2014, granted, now 9,635,759.
Claims priority of provisional application 61/866,683, filed on Aug. 16, 2013.
Claims priority of provisional application 61/971,914, filed on Mar. 28, 2014.
Prior Publication US 2017/0188454 A1, Jun. 29, 2017
Int. Cl. F21S 4/22 (2016.01); H05K 1/02 (2006.01); H05K 1/11 (2006.01); H05K 1/18 (2006.01); H05K 3/00 (2006.01); H05K 3/02 (2006.01); H05K 3/28 (2006.01); H05K 3/30 (2006.01); H01L 23/00 (2006.01); H01L 33/38 (2010.01); H01L 33/44 (2010.01); H01L 33/62 (2010.01); F21V 21/005 (2006.01); G06K 19/077 (2006.01)
CPC H05K 1/111 (2013.01) [F21S 4/22 (2016.01); F21V 21/005 (2013.01); H01L 24/97 (2013.01); H01L 33/385 (2013.01); H05K 1/028 (2013.01); H05K 1/0296 (2013.01); H05K 1/118 (2013.01); H05K 3/30 (2013.01); G06K 19/07749 (2013.01); H01L 24/29 (2013.01); H01L 24/32 (2013.01); H01L 24/48 (2013.01); H01L 24/83 (2013.01); H01L 24/85 (2013.01); H01L 33/44 (2013.01); H01L 33/62 (2013.01); H01L 2224/291 (2013.01); H01L 2224/2919 (2013.01); H01L 2224/32227 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/8385 (2013.01); H01L 2224/83424 (2013.01); H01L 2224/83439 (2013.01); H01L 2224/83444 (2013.01); H01L 2224/83447 (2013.01); H01L 2224/83801 (2013.01); H01L 2224/85424 (2013.01); H01L 2224/85439 (2013.01); H01L 2224/85444 (2013.01); H01L 2224/85447 (2013.01); H01L 2224/97 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/12041 (2013.01); H01L 2924/12043 (2013.01); H01L 2924/12044 (2013.01); H01L 2924/1421 (2013.01); H05K 1/0209 (2013.01); H05K 1/189 (2013.01); H05K 3/0097 (2013.01); H05K 3/02 (2013.01); H05K 3/28 (2013.01); H05K 2201/051 (2013.01); H05K 2201/099 (2013.01); H05K 2201/09381 (2013.01); H05K 2201/09445 (2013.01); H05K 2201/09727 (2013.01); H05K 2201/09736 (2013.01); H05K 2201/09872 (2013.01); H05K 2201/10098 (2013.01); H05K 2201/10106 (2013.01); H05K 2201/10522 (2013.01); H05K 2203/1545 (2013.01); Y02P 70/611 (2015.11); Y10T 29/4913 (2015.01)] 10 Claims
OG exemplary drawing
 
1. A conductor pad comprising:
a first contact region;
a second contact region; and
a body portion configured to establish a conductive path between the first contact region and the second contact region, the body portion comprising conductive material having a perimeter edge, the perimeter edge comprising:
a first convex segment;
a second convex segment;
a first non-convex segment disposed between the first convex segment and the second convex segment;
a third convex segment;
a second non-convex segment disposed between the second convex segment and the third convex segment;
a fourth convex segment; and
a third non-convex segment disposed between the third convex segment and the fourth convex segment;
wherein the second convex segment defines an outermost edge of the perimeter edge at a distance H2 from the horizontal axis, wherein the fourth convex segment has a fourth convex segment outermost edge at a distance H4 from the horizontal axis, and wherein the distance H2 is greater than the distance H4.