US 10,368,433 B2
Multi-layer circuit member with reference planes and ground layer surrounding and separating conductive signal pads
Chin-Yu Chen, New Taipei (TW); Cheng-Wen Chen, New Taipei (TW); Shun-Jung Chuang, New Taipei (TW); and Ke-Hao Chen, New Taipei (TW)
Assigned to FOXCONN INTERCONNECT TECHNOLOGY LIMITED, Grand Cayman (KY)
Filed by FOXCONN INTERCONNECT TECHNOLOGY LIMITED, Grand Cayman (KY)
Filed on Mar. 13, 2018, as Appl. No. 15/920,413.
Claims priority of application No. 2017 1 0145397 (CN), filed on Mar. 13, 2017.
Prior Publication US 2018/0263109 A1, Sep. 13, 2018
Int. Cl. H05K 1/02 (2006.01); H05K 1/14 (2006.01); H05K 1/11 (2006.01); H01R 12/70 (2011.01); H01R 12/78 (2011.01); H05K 1/18 (2006.01); H01R 12/71 (2011.01); H01R 13/20 (2006.01)
CPC H05K 1/0225 (2013.01) [H05K 1/0221 (2013.01); H05K 1/14 (2013.01); H01R 12/707 (2013.01); H01R 12/716 (2013.01); H01R 12/78 (2013.01); H01R 13/20 (2013.01); H05K 1/0222 (2013.01); H05K 1/0298 (2013.01); H05K 1/112 (2013.01); H05K 1/144 (2013.01); H05K 1/181 (2013.01); H05K 2201/093 (2013.01); H05K 2201/09409 (2013.01); H05K 2201/09418 (2013.01); H05K 2201/09709 (2013.01); H05K 2201/09727 (2013.01); H05K 2201/10189 (2013.01)] 9 Claims
OG exemplary drawing
 
1. A multi-layer circuit member comprising:
a first layer formed of a conductive material, the first layer including a plurality of signal pads and a first reference plane spaced apart from the plurality of signal pads, the first reference plane including an outer region surrounding the plurality of signal pads and an inner region separating the plurality of signal pads; a second layer formed of a conductive material, the second layer including a plurality of signal conductors and a second reference plane spaced apart from the plurality of signal conductors, the second reference plane including an outer region surrounding the plurality of signal conductors and an inner region separating the plurality of signal conductors;
a ground layer forms at least two corresponding neighboring grounding pads and disposed at a side of the second layer opposite from the first layer;
a plurality of dielectric layers separating the first layer, the second layer, and the ground layer; and
a plurality of conductive vias connecting the plurality of signal conductors to corresponding signal pads and connecting the first reference plane of the first layer to the second reference plane of the second layer and the ground layer;
wherein the plurality of signal pads are arranged in two rows;
wherein said two corresponding neighboring grounding pads have between a connection section extending along an oblique direction perpendicular to both the transverse direction and the longitudinal direction;
wherein one of said dielectric layers covers the first layer with opening exposing the corresponding signal pads and grounding pads while veiling the connecting section between the two neighboring grounding pads; and
wherein a first grounding plane forms at least three corresponding neighboring grounding pads between every two neighboring signal pads, and said three corresponding neighboring grounding pads commonly form a Y-shaped structure with two said connecting sections.