US 10,368,431 B2
Cooling assemblies for electronic devices
Yu-wei Chen, Taipei (TW); Yi-kai Lan, Taipei (TW); and Shih-chien Chou, Taipei (TW)
Assigned to Astec International Limited, Kwun Tong, Kowloon (HK)
Filed by Astec International Limited, Kowloon (HK)
Filed on Jul. 20, 2017, as Appl. No. 15/655,515.
Prior Publication US 2019/0029104 A1, Jan. 24, 2019
Int. Cl. H05K 1/02 (2006.01); H05K 7/20 (2006.01)
CPC H05K 1/0206 (2013.01) [H05K 7/209 (2013.01); H05K 2201/066 (2013.01); H05K 2201/10166 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A cooling assembly for cooling electronic devices, the cooling assembly comprising:
a circuit board having a first surface and a second surface opposite the first surface;
a first set of electronic devices, a second set of electronic devices, and a third set of electronic devices, each set including at least two electronic devices electrically coupled in parallel and disposed on the first surface of the circuit board, at least one of the electronic devices of the third set and at least one of the electronic devices of the second set positioned between the at least two electronic devices of the first set; and
a heat sink disposed on the second surface of the circuit board, the heat sink including a first heat sink portion in thermal contact with the first set of electronic devices, a second heat sink portion in thermal contact with the second set of electronic devices, and a third heat sink portion in thermal contact with the third set of electronic devices, the first, second and third heat sink portions positioned in an interleaved arrangement to overlap one another while remaining electrically isolated from one another.